| 摘要 |
The plate-like workpieces which are to be treated and which are, in particular, printed circuit boards (Lp) are conveyed on a horizontal conveyance track through the treatment cell (Bz) which contains electrolyte solution. Situated above the conveyance track is a soluble upper anode (Ao) which comprises soluble anode material (Am) situated on a sieve-like or grid-like carrier (Tr). Situated underneath the conveyance track is an insoluble lower anode (Au) which preferably has a sieve-like or grid-like structure and is expediently composed of platinum-plated titanium. As a result of the special combination of soluble upper anode (Ao) and insoluble lower anode (Au), the workpieces always pass through the anodes (Ao, Au) at an equal distance. This results in an extremely low variation in the layer thickness and a very good layer thickness distribution in the deposition of metal by electroplating. <IMAGE> |
