| 摘要 |
PURPOSE:To efficiently remove both sulfate and formate ions accumulated in a chemical copper plating soln. by impressing a DC voltage respectively between a metallic mesh closely attached to an anion-exchange resin membrane provided between a cathode chamber and a plating soln. regeneration chamber and a cathode and between both anode and cathode. CONSTITUTION:An aq. NaOH soln. 11 is charged in the cathode chamber 50, a chemical copper plating soln. 13 consisting of copper sulfate,, sodium formate, etc., is fed into the plating soln. regeneration chamber 60, and an aq. sulfuric acid soln. is charged in an anode chamber 70. A specified voltage is impressed between the anode 2 and the cathode 1 from a DC power source E1. Besides, the plating soln. 13 is regenerated by impressing an appropriate voltage from a DC power source E2 between the metallic mesh 3 closely attached to the face of the above-mentioned membrane 40a on the chamber 60 side and the cathode 1 to provide a nobler potential to the mesh 3 side. Moreover, a mechanism for detecting the desired ion concn. in the plating soln. 13 by automatically sampling a specified amt. of the regenerated plating soln. 13 is preferably added. The deposition of the chemical copper plating on the resin membrane 40a is prevented. |
