MATERIALE TIL BINDING AF INTEGREREDE KREDSLOEB TIL UORGANISKE, DIELEKTRISKE UNDERLAG

摘要

A composition for bonding integrated circuits to inorganic dielectric substrates comprising an admixture of finely divided particles of a thermally conductive metal or metal-containing compound, amorphous glass frit and fatty acid-based surfactant dispersed in a primary organic solvent selected from ethylene glycol monobutyl ether acetate, dimethyl adipate and mixtures thereof and optionally minor amounts of certain secondary solvents.