发明名称 |
CUTTING MECHANISM FOR BACK FACE LEAD OF PRINTED BOARD |
摘要 |
PURPOSE:To easily cut the lead of the back face of a printed board with non- contact by projecting a laser light on the lead and jetting an assisting gas as well. CONSTITUTION:The laser light 10 emitted from a laser 4 becomes a parallel light by a convex lens 6 after being spreaded by a concave lens 5 and condensed in a belt shape by a cylindrical lens 7. The part of high energy density is taken off by a slit 8 and reflected at right angles by a prism 9. The reflected laser light 10 is projected on the lead 11 of the printed board 2 which is fed intermittently. In this case an argon gas is spouted from the plural jet ports of an assisting gas jet part 3 together with the projection of the laser light 10. The lead 11 to which the laser light 10 and argon gas are added is rapidly cut with oxidizing. |
申请公布号 |
JPS6326287(A) |
申请公布日期 |
1988.02.03 |
申请号 |
JP19860168622 |
申请日期 |
1986.07.16 |
申请人 |
NEC CORP |
发明人 |
KATAYAMA SHIGERU;SATO YOSHIHIKO |
分类号 |
B21F11/00;B23K26/00;H05K13/04 |
主分类号 |
B21F11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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