发明名称 CUTTING MECHANISM FOR BACK FACE LEAD OF PRINTED BOARD
摘要 PURPOSE:To easily cut the lead of the back face of a printed board with non- contact by projecting a laser light on the lead and jetting an assisting gas as well. CONSTITUTION:The laser light 10 emitted from a laser 4 becomes a parallel light by a convex lens 6 after being spreaded by a concave lens 5 and condensed in a belt shape by a cylindrical lens 7. The part of high energy density is taken off by a slit 8 and reflected at right angles by a prism 9. The reflected laser light 10 is projected on the lead 11 of the printed board 2 which is fed intermittently. In this case an argon gas is spouted from the plural jet ports of an assisting gas jet part 3 together with the projection of the laser light 10. The lead 11 to which the laser light 10 and argon gas are added is rapidly cut with oxidizing.
申请公布号 JPS6326287(A) 申请公布日期 1988.02.03
申请号 JP19860168622 申请日期 1986.07.16
申请人 NEC CORP 发明人 KATAYAMA SHIGERU;SATO YOSHIHIKO
分类号 B21F11/00;B23K26/00;H05K13/04 主分类号 B21F11/00
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