ELECTROLESS PALLADIUM-NICKEL ALLOY PLATING LIQUID

摘要

PURPOSE:To develop an excellent electroless plating liquid for a Pd-Ni alloy by using at least one kind of ammonia and amide compd. as a stabilizer and an org. compd. contg. bivalent sulfur in combination with an aq. soln. contg. compd. of Pd and Ni and using a specific reducing agent. CONSTITUTION:0.001-8mol/l at least one kind of the ammonia or amine compd. as the plating stabilizer and 1-500mg/l org. compd. contg. bivalent S such as mercaptane are used in combination with the aq. soln. prepd. by dissolving 0.0001-0.5mol/l soluble Pd compd. such as chloride of Pd and 0.001-1.0mol/l soluble Ni compd. such as Ni chloride, and 0.005-1mol/l at least one kind of a hypophosphoric acid compd. and hydrogenated boron compd. such as dimethylamine borane is used as the reducing agent for Pd ions and Ni ions to prepair the electroless plating liquid for the Pd-Ni alloy as substitutive plating for Au plating to be used for electrical contact parts of electronic parts. Such liquid of 5-11pH is used at 10-90 deg.C liquid temp. The electroless plating liquid for the Pd-Ni alloy having small porosity and high adhesiveness is obtd.