| 摘要 |
PURPOSE:To facilitate processings from dicing to washing, separation, die bonding and the like by dividing a wafer into individual semiconductor chips, extending an adhesive sheet, adhering it to a handling ring and conducting the processings by using a wafer jig. CONSTITUTION:A ring-shaped recessed groove is formed in the upper surface of a movable receiver 6. A metallic semiconductor element handling ring 7 with a little larger diameter than that of a wafer 1 is fitted to the groove. A sheet 3 to which the wafer 1 is adhered is placed on the upper surface of the movable receiver 6 and elevated whereby the adhesive sheet 3 is extended. Thus, spaces between the adjacent semiconductor chips 2 of the diced wafer 1 are enlarged and the division of the semiconductor chips 2 is completed. The handling ring 7 and the adhesive sheet 3 are adhersively fixed by a pressure sensitive adhesive double coated tape 8 and cut off along the outline of he handling ring 7 to proceed to a cleaning process by washing. The resultant adherend is carried to a semiconductor chip separating device and the semiconductor chips 2 on the adhesive sheet 3 are peeled off to proceed to an assembling process such as die bonding and the like. |
