发明名称 |
RESIN-SEALED SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE:To facilitate the layout of lead arrangement and improve a moisture resistance by providing a tab hanging member partially exposed outside a resin- sealed body from a position deviated from a tab. CONSTITUTION:A resin sealed semiconductor device has such a structure that a tab extension 10 is formed which laterally extends along a frame 6 in a reverse direction to the one wherein a plurality of leads 3a and 3b are led out from a tab 1 and has a sufficient area and the tab extension 10 is connected with the frame 6 via a tab hanging member 11 located in a position deviated from a tab 1 to which a semiconductor pellet 12 is mounted. Although most of the tab extension 10 is formed inside a resin-sealed body 8, part of the tab hanging member 11 is exposed out of the resin-sealed body 8. Leading out tab leads in a reverse direction to those of a plurality of the leads facilitates the layout of the leads that become IC pins and improves a freedom in selecting the configuration of a lead frame and the number of the pins. |
申请公布号 |
JPS6323343(A) |
申请公布日期 |
1988.01.30 |
申请号 |
JP19870029606 |
申请日期 |
1987.02.13 |
申请人 |
HITACHI LTD |
发明人 |
SHIMIZU KAZUO;HOYA KAZUO;INOUE FUMIHITO |
分类号 |
H01L23/48;H01L23/28;H01L23/50 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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