发明名称 ADHESIVE COMPOSITION
摘要 PURPOSE:An adhesive composition useful for printed circuits or brake shoes, having increased bond strength at high temperature, consisting of a specific blended polyvinyl acetal and a thermosetting resin. CONSTITUTION:(A) A blended polyvinyl acetal subjected to mixed acetalization with butylaldehyde and acetaldehyde, satifying the formula when half-value of hydroxyl group absorption of infrared absorption spectrum is Y(cm<-1>) wherein total acetalization degree is X(mol%), axis of ordinate is percent transmission and axis of abscissa is wave number is blended with a thermosetting resin (e.g. phenolic resin, etc.) to give the aimed composition. The weight ratio of blending of the component A:B is preferably 2:3-3:2.
申请公布号 JPS6322882(A) 申请公布日期 1988.01.30
申请号 JP19870119348 申请日期 1987.05.15
申请人 SEKISUI CHEM CO LTD 发明人 MORI TAKESHI;YAMADA MASAMI
分类号 C08F8/28;C08L29/14;C09J129/14;H05K3/38 主分类号 C08F8/28
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