摘要 |
PURPOSE:An adhesive composition useful for printed circuits or brake shoes, having increased bond strength at high temperature, consisting of a specific blended polyvinyl acetal and a thermosetting resin. CONSTITUTION:(A) A blended polyvinyl acetal subjected to mixed acetalization with butylaldehyde and acetaldehyde, satifying the formula when half-value of hydroxyl group absorption of infrared absorption spectrum is Y(cm<-1>) wherein total acetalization degree is X(mol%), axis of ordinate is percent transmission and axis of abscissa is wave number is blended with a thermosetting resin (e.g. phenolic resin, etc.) to give the aimed composition. The weight ratio of blending of the component A:B is preferably 2:3-3:2. |