| 摘要 |
PURPOSE:To prevent the defect of a mold burning due to an overcurrent by affording a fuse function to part of the lead terminals having a power supply terminal and a ground terminal of a lead frame used for a mold type semiconductor integrated circuit device. CONSTITUTION:A lead frame 1 is connected to a pellet mounting portion 2 via the pad 9 of a pellet 8 and a wire 10 at one end and the other end is constituted by lead terminals 4 composed of external electrode terminals 3. A power supply terminal 5 in the external terminals 3 is connected to an external power supply. A ground terminal 6 in the external terminals 3 is connected to external ground. When the lead frame 1 is formed, notches are formed in part of the lead terminals 4 having the power supply terminal 5 and the ground terminal 6. A high-temperature solder is let flow in the notches of the lead frame 1 and the power supply and lead terminals 5 and 4 and the ground and lead terminals 6 and 4, respectively, are connected to each other. The high- temperature solder acts as a fuse. |
