FABRICATING INTERCONNECT LAYERS ON AN INTEGRATED CIRCUIT¹CHIP,申请号IE19870002047-传众专利搜索

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发明名称	FABRICATING INTERCONNECT LAYERS ON AN INTEGRATED CIRCUIT¹CHIP
摘要
申请公布号	IE872047(L)	申请公布日期	1988.01.29
申请号	IE19870002047	申请日期	1987.07.28
申请人	DIGITAL EQUIPMENT CORP	发明人
分类号	H01L21/00;(IPC1-7):H01L21/00	主分类号	H01L21/00
代理机构		代理人
主权项
地址

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