| 摘要 |
PURPOSE:To have a favorable creep strength and exhibit an excellent property of bonding as well, resulting in an improvement of reliability. CONSTITUTION:Wire materials consisting of the following components are used as raw materials for a wire bonding treatment: (1) a component containing 20-360 ppm of a sort or more than two sorts of elements selected from In, B, Bi, Ce, and Si. (2) a component containing 10-650 ppm of a sort or more than two sorts of elements selected from As, Zn, K, Mg, Ca, and T1. (3) a component containing 25-250 ppm of a sort or more than two sorts of elements selected from Sb, P, Li, Sn, Pb, and Cd. (4) The other component consisting of Cu. Thus, copper alloy having a property to suppress recsystallizetion is so effectively used as a, bonding wire 4 of semiconductor element that the lifetime of creep for breakage due to a load of tensile stress to be developed by temperature cycles can be exceedingly improved. |
