| 摘要 |
<p>PURPOSE:To eliminate the possibility of the defective cutting of a wire and the damage of a semiconductor chip and the like, and to improve reliability by insert-molding the semiconductor chip mounted to a circuit body into a substrate under the state in which the semiconductor chip is covered with a cover. CONSTITUTION:A substrate 1 is formed by a molded form consisting of a synthetic resin while a plurality of pins 2, base sections of which are insert-molded and fixed into the substrate 1, are projected from the substrate 1, and a semiconductor chip 4 is insert-molded and buried into the substrate 1 under the state in which a circuit body 3 to which the semiconductor chip 4 is mounted is connected to the base sections of the pins 2 and under the state in which the semiconductor chip 4 is covered with a cover 5. Consequently, the base sections of the pins are insert-molded to the substrate and the pins can be fastened to the substrate, thus easily fitting the pins. Action to the semiconductor chip 4 of the synthetic resin shaping the substrate 1 can be prevented, thus eliminating the cutting of wires for the semiconductor chip 4 and the damage of the semiconductor chip 4, then improving reliability.</p> |
