| 摘要 |
<p>PURPOSE:To prevent any significant chipping in cutting part from occurring by a method wherein grooves opened at specified angle are previously made centering around the surface parts corresponding to cut off parts of synthetic resin-sealed component part to be cut and splitted in the opened grooves. CONSTITUTION:Within a semiconductor photocoupler component part 16 composed of multiple pairs of circuits comprising a pair of light emitting and photodetecting elements disposed in an array to be synthetic resin-sealed, grooves 21 opened at a specified angle are previously made centering around the surface parts corresponding to cut off parts 18. The opening angle theta of the oblique groove angle 21a of opened groove 21 with the surface part of compound part 16 is made e.g. around 30 degrees. Thus, when the synthetic resin-sealed component part 16 is cut and splitted, an angle part 19a of a rotary grinding wheel 19 is cut in oblique groove surface 21a of groove 21 obliquely opened out into the surface part of component part 16 so that the stress in the case of cutting may be dispersed to minimize the chance of the chipping of component part 16 at edge part.</p> |
