发明名称 MOLD APPARATUS
摘要 PURPOSE:To reduce the generation of voids, by providing a piercing hole to a pot so as to communicate from the inner wall of the pot to the outer wall thereof. CONSTITUTION:The piercing hole 13 communicating from the inner wall of a pot to the outer wall thereof is provided in close vicinity to the part above the upper end of a tablet 3 in such a state the tablet 3 is placed on a lower mold 6. Further, an exhaust port 14 for exhausting the air in the space 10 between a head part 4 and the tablet 3 to the outside of an apparatus through the piercing hole 13 is provided to the pot. Therefore, when a plunger 5 is pushed down, the air in the space 10 can be gradually and smoothly exhausted through the piercing hole 13 and the exhaust port 14 without being compressed, and only a molten resin is introduced into a cavity 9 under pressure through a runner 8 and voids due to the involution of air in the resin are not generated. By this method, the humidity resistance of a molded body can be enhanced and the generation of cracks caused by voids can be reduced and reliability can be enhanced.
申请公布号 JPS6319218(A) 申请公布日期 1988.01.27
申请号 JP19860161903 申请日期 1986.07.11
申请人 HITACHI HOKKAI SEMICONDUCTOR LTD;HITACHI LTD 发明人 TASAKA KAZUO;KAWAMURA JUNICHI
分类号 H01L21/56;B29C45/02;B29C45/14;B29C45/34;B29L31/34 主分类号 H01L21/56
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