发明名称 MULTILAYER INTERCONNECTION BOARD
摘要 Conducting 52 and insulating 51 layers are alternated. These latter are composed of at least one organic film 51-2 and an inorganic film 51-1 which are superimposed. The attenuation and the delay in propagation of the signals are reduced. Application to integrated circuits. <IMAGE>
申请公布号 JPS6319896(A) 申请公布日期 1988.01.27
申请号 JP19860163794 申请日期 1986.07.14
申请人 NEC CORP 发明人 DOTANI AKIHIRO
分类号 H01L23/498;H01L23/538;H05K3/46 主分类号 H01L23/498
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