| 摘要 |
<p>The present invention involves a metal alloy heat sink containing tungsten, copper, and nickel. The heat sink is affixed to a ceramic substrate which supports one or more heat-generating electrical components. By adjusting the ratio of tungsten, copper, and nickel, substantial matching of the heat sink CTE with the substrate CTE is possible. Because the CTE of the heat sink is matched with that of the substrate, problems associated with differential thermal expansion are minimized, including micro-cracking and delamination. In addition, the completed heat sink has a relatively high thermal conductivity, and is capable of dissipating substantial amounts of heat.</p> |
