发明名称 METHOD AND APPARATUS FOR MANUFACTURE PLASMA CVD THIN-FILM
摘要 PURPOSE:To obtain a semiconductor thin-film having high quality by previously decomposing a desired raw material gas, supplying a reaction chamber with the decomposed raw material gas and forming the film onto a disposed into the reaction chamber in the reaction chamber. CONSTITUTION:A raw material gas is decomposed previously through one or two or more of methods in high-frequency plasma discharge, optical irradiation and heating. A raw-material gas decomposition chamber 10 capable of being kept under a predetermined vacuum is arranged under the state in which it is communicated with a raw material gas supply hole 7 for a reaction chamber 1. A film is shaped at a temperature such as a temperature of 150-400 deg.C, at high-frequency power such as high-frequency power of 0.01-1W/cm<2> applied to a high-frequency power supply 6 and at frequency such as frequency of 0.1-100MHz. Accordingly, the amorphous semiconductor thin-film having high quality is acquired.
申请公布号 JPS6317519(A) 申请公布日期 1988.01.25
申请号 JP19860161694 申请日期 1986.07.09
申请人 TOA NENRYO KOGYO KK 发明人 KAKIGI HISASHI;NAKAMURA OSAMU;YOSHIDA TOSHIHIKO;FUKUI KEITARO
分类号 H01L21/20;H01L21/205;H01L31/04 主分类号 H01L21/20
代理机构 代理人
主权项
地址