| 摘要 |
PURPOSE:To reduce the defective fraction by forming a large number of through-holes opening in the axial direction to a columnar solid resin material as a blank for a package resin-sealing a semiconductor element. CONSTITUTION:When the inside of a mold is brought to a vacuum state on mold clamping, air contained in a tablet A can also be discharged outside the mold from through-holes 21. Air in the tablet A expands in a vacuum atmosphere at that time, but a clearance delta1 is shaped between the outer circumferential surface of the tablet A and the circumferential wall surface 12a of a pot 12. Consequently, the tablet A having no air component can be moved when the tablet is pushed by a plunger head 13a, thus molding a package with no void. Accordingly, a defective fraction is lowered. |
