发明名称 ADHESIVE SHEET FOR APPLYING WAFER
摘要 <p>PURPOSE:The titled sheet, obtained by coating the substrate surface of a polymer containing a carboxyl group-containing compound with a self-adhesive layer, hardly causing deflection, capable of eliminating even slight deflection by irradiation and readily storable without mutual contact of self-adhesive sheets. CONSTITUTION:A sheet, obtained by coating a substrate prepared by laminating a polymer film 2, preferably containing a compound having carboxyl group as a polymer constituent unit to a general-purpose polymer film (2a), e.g. polyethylene, etc., with a self-adhesive layer 3 consisting of a self-adhesive and a radiation polymerizable compound and capable of sufficiently extending in expanding, providing sufficient interstices between chips, smoothly and surely picking up wafers.</p>
申请公布号 JPS6317980(A) 申请公布日期 1988.01.25
申请号 JP19860161680 申请日期 1986.07.09
申请人 F S K KK 发明人 EBE KAZUYOSHI;NARITA HIROAKI;TAGUCHI KATSUHISA;AKEDA YOSHITAKA;SAITO TAKANORI
分类号 H01L21/301;C09J7/02;H01L21/78 主分类号 H01L21/301
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