| 摘要 |
PURPOSE:To reduce the tipping of a workpiece and a working degenerated layer by spinning polishing grains added to resin raw material or using yarnlike grinding materials of grinding grains bonded to the surface of resin yarn to linearly cut off a hard and brittle workpiece. CONSTITUTION:A grinding yarn 8 is a yarn of silicon carbide grains added to nylon of polyamid system high molecular for example or may be constituted from grinding grains bonded to the surface of resin yarn. And the grinding yarn 8 is wound around three rollers 10,11,12 having grooves at a predetermined pitch and subjected to a constant tension, while being pressed against an ingot 9 of semiconductor silicon crystal to slice the ingot 9 into wafers having a predetermined thickness. Thus, since the resin has elasticity though it plays a part of binding material for grains, it damps the shock of grains abutting against the ingot 9 to reduce tipping and temperature rise of cut portions and provide a shallow worked degenerated layer. |
