| 摘要 |
PURPOSE:To enable exact position alignment of a semiconductor chip to be performed easily, by forming solder patterns on a semiconductor chip plane where the semiconductor chip is jointed with a base mount, and then forming solder patterns on the base board so as to be in accord with the solder patterns on the semiconductor chip plane. CONSTITUTION:A semiconductor chip 1 is placed on the relevant position of a sub- mount 3 where the semiconductor chip 1 is to be joined, and then the sub-mount 3 on which the semiconductor chip 1 is mounted is mounted on the upper plane of a metallic mount 5. When the metallic mount 5 is heated from below, solder materials of the solder patterns 11 and 12 are fused. At the time when the solder materials begin to be fused, the solder patterns 12 on the semiconductor chip 1 and that 12 on the submount 3 are attracted to each other, to automatically correct their positioning shift. When the semiconductor chip 1 is pressed from above, the solder materials of the solder patterns 11 and 12 spread to reach the recessed parts which are formed around the solder patterns 12 on the sub-mount 3, to be mixed with the solder materials 12b existing in the recessed parts. When temperature is lowered with this pressing state maintained, the semiconductor chip 1, the sub-mount 3, and the metallic mount 5 can be jointed unitedly with one another.
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