| 摘要 |
PURPOSE:To increase packaging density, to eliminate the need for the bending of the leg of a lead and to reduce manufacturing cost by forming constitution in which the end of the lead is exposed to the base of a resin package. CONSTITUTION:Each lead 13 is bent in the direction of the height H of a resin package 15 in the resin package 15, other end sides 13b of the leads 13 are made level, one parts of other end sides 13b are exposed to the base 15a of the resin package 15, and nose sections are extended to the sides of the resin package 15 from the base 15a of the resin package 15. Solder 17 is padded onto the lower surfaces of other end sides 13b (consisting of exposed sections 13b-1 and extending sections 13b-2), and other end sides 13b fill the role of terminals 18. The terminals 18 are soldered to corresponding electrodes for a printed circuit substrate, and mounted to the surface of the printed circuit substrate, thus increasing packaging density, thereby reducing manufacturing cost. |
