| 摘要 |
PURPOSE:To absorb internal stress, and to prevent the damage of a sealing resin layer, etc. by housing a semiconductor element into a cavity section formed into the sealing resin layer, while keeping space. CONSTITUTION:A semiconductor element 1 is bonded with a pad 2 in a 42-pin DIP frame by using polyimide group adhesive paste containing conductive powder, and connected to leads 3 in the frame by gold wires 5. One of upper and lower two-piece caps 6 made of an epoxy resin is positioned and fixed by a fluorocarbon resin adhesive tape 7 while the other of the caps made of the epoxy resin is fastened similarly by the fluorocarbon resin adhesive tape 7 and both caps are unified so that the semiconductor element 1 with the pad 2, the gold wires 5 and the nose side sections of the leads 3 are housed into a cavity section in a sealing resin layer 8, while maintaining space. The whole is treated to a low-pressure transfer press machine, and trans fer-molded by employing an epoxy resin composition, thus manufacturing a semiconductor device. |
