| 摘要 |
<p>PURPOSE:To provide an adhesive tape having good workability and high space efficiency and suitable for attaching wafer in wafer dicing process, prepd. by applying adhesives with specified adhesiveness on both sides of a sheet material. CONSTITUTION:The adhesive tape is prepd. by forming a layer 12 of an adhesive having low bonding power and a layer 11 of an adhesive having high bonding power on the upper side (where a wafer 14 is to be attached) and on the lower side (where a wafer ring 13 is to be attached) of a sheet material 10 (base sheet for adhesive tape), respectively. A wafer 14 and a wafer ring 13 are attached to the adhesive tape and the wafer 14 is cut into pellets of a predetermined size by means of a dicing blade 15. When the pellet is ejected from the tape and filled into a jig, it is readily separated from the tape without causing peeling-off of tape from the wafer ring 13. Thus the pellet is filled into a jig smoothly and efficiently.</p> |
