| 摘要 |
The invention relates to an arrangement of semiconductor components on a heat sink, in the case of which arrangement the semiconductor components (16) are each mounted on one limb (11) of a supporting body (10) in the form of a bracket, and the other limb (12) of the supporting body (10) is connected in a thermally conductive manner to the heat sink (14), with the interposition of an electrically non-conductive layer (15). In order to be able to construct that limb (12) of the supporting body (10) which rests on the heat sink (14) to be the same width as the limb (11) which supports the semiconductor components (16), it is proposed that a transverse bar (17), which consists of electrically non-conductive material, be placed over the other limb (12) of the supporting body (10) and that said transverse bar (17) be fastened to the heat sink (14) by means of fastening elements (13). <IMAGE>
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