发明名称 |
METHOD FOR BONDING A CONTACT |
摘要 |
PCT No. PCT/JP82/00013 Sec. 371 Date Jul. 19, 1982 Sec. 102(e) Date Jul. 19, 1982 PCT Filed Jan. 14, 1982 PCT Pub. No. WO82/02621 PCT Pub. Date Aug. 5, 1982.The gap between upper and lower electrodes 1, 2 is measured at constant intervals of time while a contact 5 and a base 6 are pressed by the upper and lower electrodes under a constant pressure. Supply of an electric current to the upper and lower electrodes is controlled upon elapse of a predetermined interval of time after the gap has reached a maximum 18. The amount of metal melted out of a joining interface between the contact 5 and the base 6 is thus quantized to improve and stabilize the quality of joining between the contact 5 and the base 6. |
申请公布号 |
DE3277829(D1) |
申请公布日期 |
1988.01.21 |
申请号 |
DE19823277829 |
申请日期 |
1982.01.14 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
MACHIDA, KAZUMICHI MITSUBISHI DENKI K.K.;INADA, MIKIO |
分类号 |
H01H11/06;B23K1/00;B23K11/24;B23K11/25;H01H11/04;(IPC1-7):H01H11/06 |
主分类号 |
H01H11/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|