发明名称 METHOD FOR BONDING A CONTACT
摘要 PCT No. PCT/JP82/00013 Sec. 371 Date Jul. 19, 1982 Sec. 102(e) Date Jul. 19, 1982 PCT Filed Jan. 14, 1982 PCT Pub. No. WO82/02621 PCT Pub. Date Aug. 5, 1982.The gap between upper and lower electrodes 1, 2 is measured at constant intervals of time while a contact 5 and a base 6 are pressed by the upper and lower electrodes under a constant pressure. Supply of an electric current to the upper and lower electrodes is controlled upon elapse of a predetermined interval of time after the gap has reached a maximum 18. The amount of metal melted out of a joining interface between the contact 5 and the base 6 is thus quantized to improve and stabilize the quality of joining between the contact 5 and the base 6.
申请公布号 DE3277829(D1) 申请公布日期 1988.01.21
申请号 DE19823277829 申请日期 1982.01.14
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 MACHIDA, KAZUMICHI MITSUBISHI DENKI K.K.;INADA, MIKIO
分类号 H01H11/06;B23K1/00;B23K11/24;B23K11/25;H01H11/04;(IPC1-7):H01H11/06 主分类号 H01H11/06
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