| 摘要 |
PURPOSE:To facilitate the reinforcement of an IC and an increase in the thin type of an IC module and to obtain a highly reliable very thin type IC module by a method wherein the IC is connected to a junction terminal on a tapelike wiring substrate through a bump electrode and the wiring substrate and the IC are molded in such a way as to be sealed integrally with resin. CONSTITUTION:An IC module is formed into one having a structure, wherein a resin base film is used as a substrate, the junction terminal 5 of a tapelike wiring substrate 4 with such conductor patterns as a wiring 6 and the junction terminal 5 which are formed on this substrate and an IC 1 are connected through a bump electrode 2' and the above wiring substrate 4 and the IC 1 are molded in such a way as to be sealed integrally with a resin 10. Moreover, for example, when contact terminal 8 for external apparatus are provided on part of the conductor patterns of the above wiring substrate 4 and the wiring substrate 4 and the IC 1 are sealed with the resin 10, the contact terminals 8 are so contrived as to be exposed their upper parts. Thereby, the connection of the IC to be buried and the wiring substrate is reliable and also, can be attained in a smaller dimension and furthermore, as the upper surface and lower surface of the IC are both completely protected and reinforced, it is easier to form the IC module into a thin type, thereby enabling to obtain the highly reliable IC module. |
