发明名称
摘要 PURPOSE:To form a hard Al2O3 film on a substrate of a metal or the like by reacting Al vapor from an evaporating source with gaseous O2 as a reactive gas in an arc discharge type high vacuum ion plating apparatus. CONSTITUTION:A hard Al2O3 film having >=2000 micro-Knoop hardness is formed on the surface of a substrate such as a steel plate preheated to 500 deg.C by an activated reactive ion plating method using high purity Al as an evaporating source and gaseous O2 as a reactive gas in an arc discharge type high vacuum ion plating apparatus. Conditions during the ion plating include 10kV-500-550mA output of an electron gun, 7-10X10<-5>Torr pressure of gaseous O2, 0.3-0.5kV voltage of the substrate, 40A thermoelectron current and 15-20A ionization current.
申请公布号 JPS633021(B2) 申请公布日期 1988.01.21
申请号 JP19840202399 申请日期 1984.09.27
申请人 SHIZUOKAKEN 发明人 KUWANO SABURO;SUGYAMA MASAHIRO;SHIBUYA YOSHIO;OOTAKE TERUNORI
分类号 C23C14/08;C23C14/32 主分类号 C23C14/08
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