发明名称 Process for suppressing the rise of the buried layer of a semiconductor device.
摘要 <p>A semiconductor device to which the present invention is adapted consists of a support region (1), an element-forming region (7) and a buried layer (2, 3) therebetween, that are formed in a semiconductor substrate. On the element-forming region (7) is mounted at least either one of the MOS element (11, 12) or the bipolar element (14). The feature of the present invention resides in that element of at least one kind selected from oxygen, nitrogen, carbon, argon, neon, krypton and helium, is contained in at least either one of the element-forming region (7) or the buried layer (2, 3).</p>
申请公布号 EP0253059(A2) 申请公布日期 1988.01.20
申请号 EP19870104097 申请日期 1987.03.20
申请人 HITACHI, LTD. 发明人 SAWAHATA, YASUO;SAITO, RYUICHI;MOMMA, NAOHIRO
分类号 H01L29/73;H01L21/265;H01L21/331;H01L21/74;H01L21/8234;H01L27/06;H01L29/10;H01L29/167;H01L29/78 主分类号 H01L29/73
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