发明名称 WORK HOLDING AND CHIP REMOVING DEVICES FOR SURFACE GRINDER
摘要 PURPOSE:To make a series of grinding operations possible to be fully automated, by installing a work holding device facing to a chuck when a rotor exists in a first position and a chip removing device facing to the chuck when it exists in a second position both in this rotor. CONSTITUTION:A work 22 is carried and mounted onto a magnet chuck 21 of a surface grinder by a holding device 9a of a rotary bracket 9 attached to a three-dimensional control robot 1. Next, in time of grinding operation for the work 22, jaws 11 of the holding device 9a are unfastened and the bracket 9 is drawn back to a position where it will not interfere with a grinding wheel. On finishing the grinding operation, the work 22 is chucked by the holding device 9a, lifting the work slightly upward and causing the bracket 9 to rotate as far as 180deg, and a chip removing member 14 is made face-to-face with the chuck 21, going down till it touches the chuck 21, whereby the member 14 is rotated by driving force of a motor 13 and grinding chips on the chuck 21 are removed. Afterward, the robot 1 transfers the work up to the specified position.
申请公布号 JPS59219159(A) 申请公布日期 1984.12.10
申请号 JP19830094104 申请日期 1983.05.30
申请人 KANETSUU KOGYO KK 发明人 YABUNO SADAO
分类号 B23Q11/00;B24B55/00;B24B55/06;B25J15/00;(IPC1-7):B24B55/06 主分类号 B23Q11/00
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