Synthetic resin composition, substrate material for printed circuit boards and method of manufacturing a synthetic resin composition.

摘要

The invention relates to a synthetic resin composition comprising a phenol-formaldehyde resin and a polyurethane component, and to a substrate material for printed circuit boards, comprising a fibrous carrier material which is impregnated with such a synthetic resin composition. As the phenol-formaldehyde resin is prepared from a phenol and a formaldehyde-producing compound in the presence of the polyurethane component and a basic catalyst, an interpolymer is formed which upon further processing yields a substrate material which is on the one hand suitable to be provided with holes by punching and piercing and on the other is not subject to an objectionable degree of sagging during the soldering of components onto the printed circuit board by means of a wavesoldering bath.