| 摘要 |
PURPOSE:To improve the defective intrinsic to soldering property and wire bonding property of stainless steel by a method wherein an activated surface of a stamped stainless steel made lead frame is immediately Ni-plated and further very thinly plated with Au, Ag, Pd and so forth. CONSTITUTION:A stainless steel made lead frame material stamped into a lead frame type of SUS-304 is Ni flash plated after performing the processes 1-5 mentioned as follows and immediately very thinly plated with Au. (1): Alkali degreasing process is performed by passing the lead frame material through a tank of alkali degreaser as primary degreasing before DC electrolic degreasing. (2): Chemical grinding process is performed by removing any oxide and impurities on the surface. (3): Electrolic activating process is performed as flash plating for 15 seconds. (4): Ni-plating process is made by performing flash-plating for 15 second (5): Au plating for 2 seconds. |
