| 摘要 |
<p>PURPOSE:To efficiently radiate heat produced within semiconductor elements by forming slots in a resin sealed package. CONSTITUTION:After a semiconductor element 3 is mounted on a lead frame, the entire lead frame 1, except distal ends of lead conductors 2, is sealed with a resin 5 having slots 8 for partially exposing the rear of the lead frame 1. The slots 8 may be opened in such a manner that a molding die is provided with projections for directly supporting the lead frame set to the die. Such projections can be formed by a relatively simple operation. It is perferable that the protrusion are tapered so that they can be easily taken out of the formed resin unit. What is more, when a semiconductor device is mounted on a printed circuit board through a silicon grease, it is insulated from the board by the resin 5.</p> |
