| 摘要 |
This method makes it possible to mount, onto the board 1, components 12, 10, 11, 16, 17 of different technological families and to solder their connections to both sides 8, 9 of the board 1 in one and the same wave-soldering operation. It consists in making additional plated-through holes 22 in the board 1, in relation to the plated-through holes normally provided for mounting the components 12 and their connection leads (pins) 13. These holes 22 are produced in the region of the soldering lands for the surface-mounted components 10, 11 of the side 8 not subjected to the solder wave. After mounting the insertion-type components 12 and bonding 23, 24, 25, 26 the surface-mounted components 10, 11, 16, 17, the side 9 of the board is passed over the solder wave. The leads (pins) 13 and the components 16, 17 are thus soldered, but also, simultaneously, the solder penetrates the additional holes 22 and spreads out over the connection lands for the leads (pins) of the components 10, 11 arranged on the other side 8 of the board 1. <IMAGE>
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