| 摘要 |
<p>Multiple-plate hybrid device with incorporated heat dissipation for thick film hybrid substrates (14) comprising hybrid circuits. In this device the thick-film hybrid substrates are inserted in metal frames (2, 5) of a metal housing (1) and are connected at least partly with parts of the metal frames in order to dissipate the heat generated. Connection bars (26) projecting from the thick-film hybrid substrates are combined by means of a connection strip (25), which cooperates with a connector (22).</p> |
