发明名称 RESIN MOLDING METHOD OF ELECTRONIC ELEMENT AND MOLDING DIE THEREFOR
摘要 PURPOSE:To ensure the resin sealing of an electronic element excellently, by injecting a resin into a cavity through film gates or pin point gates, which are arranged so as to face the centers on both upper and bottom surfaces of the electronic element, which is inserted in the circular cavity. CONSTITUTION:When fused resin 19 is injected through a resin injecting port 5, the resin is divided and flows into runners 7 and 8 on the side of first and fourth divided blocks 1 and 4 by way of a longitudinal spool 6 and into runners 7 and 8 on the side of second and third divided blocks 2 and 3. The resin flows into a cavity 10 through gates (film gates) 9 and 9, which face the central parts of upper and bottom surfaces of an electronic element 16. Thus the electronic element 16 is sealed to a substrate 17 having terminals with the resin. At this time, the flow of the resin 19 in the cavity 10 is balanced, and the inside of the cavity is excellently filled up with the resin. Therefore, a highly reliable molded product 30 is obtained.
申请公布号 JPS637639(A) 申请公布日期 1988.01.13
申请号 JP19860152555 申请日期 1986.06.28
申请人 TOWA EREKUTORON KK 发明人 NAKAMURA TADASHI;NAKAMURA ISAMU
分类号 H01L21/56;B29C45/02;B29C45/14;B29C45/26;B29L31/34 主分类号 H01L21/56
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