发明名称 |
Adhesive sheets for sticking wafers thereto. |
摘要 |
<p>according to the present invention are adhesive sheets which are applied to the face side of wafers having formed patterns thereon when the reverse side of said wafers are subjected to grinding treatment, characterized in that the adhesive sheets comprise a base and a water-swelling adhesive coated thereon as an adhesive layer.</p> |
申请公布号 |
EP0252739(A2) |
申请公布日期 |
1988.01.13 |
申请号 |
EP19870306075 |
申请日期 |
1987.07.09 |
申请人 |
LINTEC CORPORATION |
发明人 |
EBE,KAZUYOSHI;NARITA,HIROAKI;TAGUCHI,KATSUHISA;AKEDA,YOSHITAKA;SAITO,TAKANORI |
分类号 |
C09J7/02;H01L21/302 |
主分类号 |
C09J7/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|