| 摘要 |
<p>PURPOSE:To laminate an overlay film under pressure without applying 'squeezing' to a circuit and the overlay film, by a method wherein a substrate having the circuit adhered thereto and the overlay film are integrally held between metal belts and pressed by a hot roll on the way of feed to be laminated before cooled under pressure by a cooling roll. CONSTITUTION:A substrate 2 and an overlay film 3 are held between two belts 22, 27 to be fed and heated in an oven 13 to vent air and successively pressed by rolls, 30, 31, 32, 33 of a hot roll unit 14. Since the substrate 2 and the overlay film 3 are held between the belts 22, 27 and indirectly pressed, both of them receive force due to a plane and effect due to the core shift of the rolls 30-33 and the change in pressure balance is removed. Further, the substrate 2 and the overlay film 3 are pressed and cooled in a state held between the belts 22, 27 by a cooling roll 15 and the overlay film 3 laminated to the substrate 2 receives no 'squeezing' even by the cooling roll 15 and dimensional stability is secured.</p> |
