发明名称 |
Semiconductor wafer temperature measuring device and method. |
摘要 |
<p>A probe having four spring-loaded tips contacts the backside of a semiconductor wafer in a processing machine. A current is induced across the outer tips and a voltage proportional to the sheet resistance of the wafer is measured across the inner tips. Wafer thickness is used to convert sheet resistance to bulk resistivity. Data on resistivity as a function of temperature is used to determine wafer temperature.</p> |
申请公布号 |
EP0252697(A2) |
申请公布日期 |
1988.01.13 |
申请号 |
EP19870305925 |
申请日期 |
1987.07.03 |
申请人 |
VARIAN ASSOCIATES, INC. |
发明人 |
POWELL, RONALD A.;FELCH, SUSAN B. |
分类号 |
H01L21/66;G01K7/00;G01K7/22;G01K13/00;G01R31/28 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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