发明名称 |
METHOD FOR MANUFACTURE OF PRINTED CIRCUIT BOARDS |
摘要 |
A method of preparing printed circuit boards in which the solder mask (24) is applied over a thin layer (''smut'') of tin covering the copper circuit traces, the tin layer being that which remains after stripping tin or tin-lead alloy etch resist (22). This represents a significant cost saving as compared with processes in which the tin-lead alloy (20) is completely stripped leaving bare copper to which the solder mask (24) is applied in the SMOBC type of circuit board. |
申请公布号 |
AU7641287(A) |
申请公布日期 |
1988.01.12 |
申请号 |
AU19870076412 |
申请日期 |
1987.06.17 |
申请人 |
MACDERMID, INC., |
发明人 |
PETER E. KUKANSKIS;CHARLES T. COBB;RAYMOND A. LETIZE;ANN S. WILLIAMS;ANNE MONTFORT;LEO J. SLOMINSKI |
分类号 |
H05K3/28;H05K3/06;H05K3/10;H05K3/24;H05K3/34;H05K3/38;H05K3/42 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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