发明名称 |
Method of removing seed particles from circuit board substrate surface |
摘要 |
A method of making a printed circuit board is disclosed wherein metallic seed particles are applied to a surface of the substrate. An image of the desired conductor pattern is defined by a maskant layer to permit the subsequent electroless deposition of the conductor material upon the exposed seeded areas of the substrate. Then, the substrate surface is subjected to a plasma discharge to facilitate removal of the seed particles.
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申请公布号 |
US4718972(A) |
申请公布日期 |
1988.01.12 |
申请号 |
US19860822216 |
申请日期 |
1986.01.24 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BABU, SURYADEVARA V.;HERRMANN, WILLIAM F.;HOFFARTH, JOSEPH G.;MARKOVICH, VOYA;WILEY, ROBERT T. |
分类号 |
C23C18/30;C23C18/36;H05K3/08;H05K3/18;H05K3/26;(IPC1-7):H05K3/18;H05K3/22;B05D3/04 |
主分类号 |
C23C18/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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