| 摘要 |
PURPOSE:To enable a ground length to become small to realize decreases in inductance of ground wires, by forming a dielectric substrate thinly on a part for mounting a transistor. CONSTITUTION:A transistor 4 and a capacitor 5 for impedance transduction are mounted on a dielectric substrate 2. Then, the part of the substrate 2, whereon the transistor 4 is mounted, is made to become small in thickness. As to grounding, a base of the transistor 4 becomes nearly as flat as the ground plane. Because a separation gap becomes needless between the part for mounting the transistor and the input part in the metalized plat 3b, grounding length is widely reduced. Hence, decreases in inductace of the ground wires 7a, 7b can be performed. |
