MANUFACTURE OF ELECTRONIC COMPONENT

摘要

PURPOSE:To improve adhesive properties of a transferring original sheet to a conducting oxide film, by providing the original sheet with a bump having grain diameters distributed. CONSTITUTION:A Cr film 2 as a conducting film and an ITO film 3 as a conducting oxide film are formed sequentially on a glass substrate 1 by means of the vapor deposition. Then, a resist pattern 4 is provided on the ITO film 3. A transferring original sheet 5 is thereby produced. Subsequently, the transferring original sheet 5 is electroplated with gold so as to form a gold bump 6 on the ITO film 3. A Cu electrode lead 8 provided on a polyimide film 7 and plated with Sn on the surface thereof is disposed on the bump 6 of the transferring original sheet 5 and thermally contact bonded by a heated bonding tool 9. After that, the bump 6 of the transferring original sheet 5 is transferred to the lead 8. The transferred bump 6 is then positioned over an aluminium electrode section 12 of a semiconductor chip 10 and heated by the bonding tool 9, so that the electrode lead 8 is connected to the aluminium electrode section 12 of the semiconductor chip 10 through the gold bump 6. Thus, an electronic component can be obtained.