| 摘要 |
To form a sturdy, environmentally essentially unaffected and high-temperature resistance electrical connection between a connection wire (4) and a conductive track (2) on the substrate (1), a portion of the wire (4) is embedded in a unitary bonding element (3). The bonding element comprises about 70% of metal particles and 30% of glass particles to form a bonding spot. The bonding spot is made by applying a paste of glass and platinum powder, with the glass powder having a grain size several times larger than the platinum powder on the conductive track (2), pressing the end portion of the connection wire (4) into the spot so that the wire will be completely surrounded, and then firing the bonding spot. If the conductive track (2) is applied by film technology, firing of the conductive track (2) and of the bonding spot (3) can be carried out in a single operating step. Preferably, the conductive track and the bonding spot (3), as well as the connecting wire (4), have temperature coefficient-compatible components which, preferably, are similar or the same. The conductive track may be a temperature raising resistor (R).
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