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经营范围
发明名称
PACKAGE GRINDING MACHINE FOR SEMICONDUCTOR DEVICE
摘要
申请公布号
JPS635546(A)
申请公布日期
1988.01.11
申请号
JP19860150570
申请日期
1986.06.25
申请人
SHARP CORP
发明人
ASAI SHIGEMI;SHIMANO KIYOJI;HISATOMI JUNICHIRO
分类号
H01L23/02
主分类号
H01L23/02
代理机构
代理人
主权项
地址
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