| 摘要 |
Printed circuit boards and methods for uniformly electroplating narrow, closely spaced circuitry lines onto such a circuit board substrates are disclosed. The method comprises providing an electroplating tank containing an electroplating solution with at least one anode immersed therein. A conductive metal screen is immersed in and extends across the electroplating solution at a solution spaced apart from such an anodes. A printed circuit board substrate is then placed into the electroplating solution at a position wherein the screen is between the anode and the substrate. Copper is then simultaneously plated onto the printed circuit board substrate at a first voltage and onto the screen at a second voltage when the second voltage is less than the first voltage. |
