发明名称 CATALYTIC SOLUTION OF COPPER COLLOID FOR ELECTROLESS PLATING AND ITS PRODUCTION
摘要 PURPOSE:To produce a catalytic soln. enabling satisfactory electroless plating on an electrically insulating substance by preparing an aqueous soln. of a specified pH contg. specified amounts of metal copper particles, gelatin, polyethylene glycol having a specified mol.wt. and alpha,alpha'-dipyridyl. CONSTITUTION:An aqueous soln. contg. >=0.3g/l bivalent copper ions, >=0.8g gelatin basing on 1g copper ions and >=0.8g polyethylene glycol having 1,000-20,000 average mol.wt. is prepd. The soln. is heated to >=40 deg.C and about 1-100mg/l alpha,alpha'-dipyridyl and >=1.2g dimethylamine borane basing on 1g bivalent copper ions are added to the soln. to reduce the bivalent copper ions to metal copper. The pH of the soln. is then adjusted to 2-9. When the surface of an electrically insulating resin is treated with the resulting catalytic soln. of copper colloid for electroless plating, perfect coating can be carried out by electroless plating.
申请公布号 JPS634074(A) 申请公布日期 1988.01.09
申请号 JP19860147620 申请日期 1986.06.24
申请人 NEC CORP 发明人 SATO TAKAO;KOBAYASHI KENJI;MITSUI SHINICHI
分类号 C23C18/30 主分类号 C23C18/30
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