| 摘要 |
PURPOSE:To take most negative potential in an integrated circuit in a pellet extremly effectively to a radiation fin by forming a bonding pad in a flat surface through coining working in the radiation fin. CONSTITUTION:A plurality of bonding pads 8 are arranged in groove 7 groups on the upper surfaces of radiation fins 5, and shaped through coining working so that the upper surfaces of the bonding pads are formed in flat surfaces. The plane shape of the bonding pad 8 is formed circularly while an area thereof is set in a minimum area required for wire bonding work. Accordingly, wires can be bonded properly with the radiation fins, thus taking most negative potential in an integrated circuit in a pellet extremely effectively to the radiation fins.
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