| 摘要 |
PURPOSE:To form a semiconductor device in a small type, to reduce the exclusively prosessing area at semiconductor elements fixing time to a printed substrate, etc., and to enable to mount the semiconductor elements in high density by a method wherein the semiconductor elements are arranged on both the main surfaces of a package main body. CONSTITUTION:Semiconductor element accommodating parts 6a, 6b are formed respectively on both the main surfaces of a package main body 6. A part of each lead terminal 8a and 8b is buried respectively in the package main body 6, one edge is extended respectively to the outside, and moreover another edge is connected electrically to semiconductor elements 7a, 7b respectively in the respective semiconductor element accommodating parts 6a, 6b according to bonding wires 9. Because the respective lead terminals 8a, 8b are made independently mutually in such a way, by making the semiconductor elements 7a, 7b arranged on the respective main surfaces of the package main body 6 to have a different function respectively, the semiconductor device can be made to have the functions two times of the usual semiconductor device, and mounting density can be enhanced. |
