| 摘要 |
PURPOSE:To manufacture a package for semiconductor integrated circuit needless to extend bonding wires by a method wherein openings of an insulating sheet bonded on a metallic sheet formed of an island whereon a semiconductor pellet is to be mounted are formed into comb type. CONSTITUTION:A metallic sheet 1 formed of an island 2 whereon a semiconductor pellet 1 is to be mounted is provided with comb type openings exposed to the semiconductor pellet 1 while a ceramics made insulating sheet 3 provided with inner interconnections 4 is bonded onto the surface of metallic sheet 1. Bonding wires for grounding are bonded onto the surface 6A of metallic sheet 1 exposed to the comb type openings 5 while other bonding wires for signal interconnection etc. are bonded to the inner interconnections 4 on insulating sheet 3. Through these procedures, the inductance of interconnection for grounding can be prevented from increasing further preventing the bonding wire length of signal interconnection etc. from extending. |
